The increased use of Carbon Fiber-Reinforced Polymers (CFRPs) in aerospace applications has brought challenges regarding Lightning Strike Protection (LSP) due to their low electrical conductivity. Currently, the protective solution employed is the addition of metallic foils or meshes on the external part of the CRFPs laminate. While effective, these solutions significantly increase the weight of the structure and their integration process is often labor-intensive and costly, which motivates the development of alternative solutions. This work investigates the metallization with copper of polyetheretherketone (PEEK) veils and films as a lightweight and efficient LSP system of thermoplastic-based composite. Copper layers of different thicknesses were deposited onto PEEK veils and films via Physical Vapor Deposition (PVD) technique. Then, these metallized veils and films were integrated into PEEK/CF panels through an oven consolidation process. Electrical resistance, sheet resistance, and surface morphology were analyzed to evaluate conductivity and adhesion between the films/veils and the PEEK/CF laminates. As it was expected, the increasing of the copper thickness significantly reduced sheet resistance, achieving values in the range of the bulk electrical resistance of pure copper for metallized films with 1.1 microns of thickness. Microstructural analysis of integration trials also revealed differences in copper distribution between veils and films, with veils showing better integration and morphology post-consolidation. This study demonstrates that copper-metallized PEEK veils and films could be promising candidates as LSP systems for thermoplastic composites, offering substantial weight savings compared to traditional solutions.